Grand Valley State University
Microelectronic packaging
Type
http://bibfra.me/vocab/lite/Concept
Label
Microelectronic packaging
Name
Microelectronic packaging
Focus
Microelectronic packaging
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Multichip modules, systems advantages, major constructions, and materials technologies, edited by R. Wayne Johnson, Robert K.F. Teng, John W. Balde
Outgoing Resources
Focus
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Microelectronic packaging
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